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IC Carrier

  • Home
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  • IC Carrier

Coreless

Production Information

Features

  • Layer count : 1L / 2L / 3L / 4L , etc.
  • Thickness: 100 um (1.5L) ~ 225 um (5L)
  • Embedded trace (down to 20 um pitch)

Benefits

  • Better Electrical Performance
  • Lower Cost
  • Thinner Substrate
  • Better Reliability Performance
  • More flexible and dense design requirement

Applications

  • High Performance CPU
  • GPU, ASIC Devices
  • Desktop / Server
  • Networking
  • Game Console
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