Coreless
Production Information
Features
- Layer count : 1L / 2L / 3L / 4L , etc.
- Thickness: 100 um (1.5L) ~ 225 um (5L)
- Embedded trace (down to 20 um pitch)
Benefits
- Better Electrical Performance
- Lower Cost
- Thinner Substrate
- Better Reliability Performance
- More flexible and dense design requirement
Applications
- High Performance CPU
- GPU, ASIC Devices
- Desktop / Server
- Networking
- Game Console